Tungsten core wire for semiconductor production
- Tungsten core wire is the next-generation wire saw core wire for semiconductor production. - The production line started operating in 2024 in Zhuzhou, Hunan.
●Product Name: Tungsten Core Wire for Semiconductor Production ●Wire Diameter: 35μm = 0.035mm (30μm wire is also available) ●Application: Core wire for multi-wire diamond saw → A ●Material: Tungsten W - Rhenium Re 0.6% alloy WR 0.6 → B ●Production Process: W powder → Re doping → Powder metallurgy forging → Round bar → 0.39mm raw wire → Hot drawing through multi-stage die → 0.035mm wire ●Packaging: ・35μm wire: Approximately 120km roll, weight about 20g/km ・30μm wire: Approximately 150km roll, about 17g/km ●Hazardous Materials: No ●Toxicity: None ●Quality Standard: ASTM B760 ●Physical Properties Table: ・Specific Gravity Sp: 19.3g/cm³ ・Melting Point: 3380°C: The highest among metals ●Strength: ・Φ35μm wire: ・Break: 5.7N = 580gf ・Tensile: 5800Mpa ・Φ30μm wire: ・Break: 4.3N = 440gf ・Tensile: 6100Mpa ●Comparison of Physical Properties with High Carbon Steel Core Wire: ・Electrical Resistivity: About half that of carbon steel → C ・Breaking Strength: Over 1.2 times ・Torsional Rigidity: Over 10 times ・Young's Modulus: 1.7 times ・Elongation Ratio: About 60% ●Chemical Properties: ・Reaction with O2: Burns at 400-700°C to produce WO3 → Cooling and oxidation prevention measures are necessary → D
- Company：アソシエイト トレーディング 土屋 裕 v09018951120 qq3508274141 ttt@zd.wakwak.com
- Price：500,000 yen-1 million yen
